Everything about IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026: where it's held (Intex Osaka), when (May 12, 2026 to May 14, 2026), exhibitor list, tickets, and how to exhibit. Official sources and verified database facts.
IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 takes place at Intex Osaka, 1-5-102 Nanko-Kita, Suminoe-kuOsaka, 559-0034, Japan.
Venue website: http://www.intex-osaka.com
IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 runs from May 12, 2026 to May 14, 2026.
IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 focuses on the Electronic Design & Components, Measurement, Control & Testing sector.
Registration and ticketing information is typically available through the official fair organizer. Visit the fair page on AFFAEL or the organizer's website for current registration and visitor pass details.
Booth rental at IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 (Intex Osaka, Japan) covers space-only, shell scheme, and custom turnkey options. Submit a booth inquiry → for providers familiar with this venue. See our booth services guide for what each option includes.
IC & SENSOR PACKAGING EXPO JAPAN - OSAKA is a recurring trade fair. Check the fair page for upcoming edition details.