IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026

TL;DR — IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 runs Tue May 12 2026 to Thu May 14 2026 at Intex Osaka in Intex Osaka, Japan — a Electronic Design & Components, Measurement, Control & Testing industry event.

About IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Frequently Asked Questions about IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026

When is IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026?

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 takes place from May 12, 2026 to May 14, 2026, running for 3 days at Intex Osaka.

Where is IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 held?

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 is held at Intex Osaka, Japan. The venue address is 1-5-102 Nanko-Kita, Suminoe-kuOsaka, 559-0034. See full venue details →

Who exhibits at IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026?

Exhibitor information for IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 will be published closer to the event date.

Who organizes IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026?

Organizer information for IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2026 will be published on the official fair page.

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