Everything about IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027: where it's held (Tokyo International Exhibition Center (Tokyo Big Sight)), when (February 16, 2027 to February 18, 2027), exhibitor list, tickets, and how to exhibit. Official sources and verified database facts.
IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 takes place at Tokyo International Exhibition Center (Tokyo Big Sight), 3-21-1 AriakeKoto-kuTokyo 135-0063, Japan.
Venue website: http://www.bigsight.jp/english
IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 runs from February 16, 2027 to February 18, 2027.
IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 focuses on the Electronic Design & Components, Measurement, Control & Testing sector.
Registration and ticketing information is typically available through the official fair organizer. Visit the fair page on AFFAEL or the organizer's website for current registration and visitor pass details.
Booth rental at IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 (Tokyo International Exhibition Center (Tokyo Big Sight), Japan) covers space-only, shell scheme, and custom turnkey options. Submit a booth inquiry → for providers familiar with this venue. See our booth services guide for what each option includes.
IC & SENSOR PACKAGING EXPO JAPAN - TOKYO is a recurring trade fair. Check the fair page for upcoming edition details.