IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027

TL;DR — IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 runs Tue Feb 16 2027 to Thu Feb 18 2027 at Tokyo International Exhibition Center (Tokyo Big Sight) in Tokyo International Exhibition Center (Tokyo Big Sight), Japan — a Electronic Design & Components, Measurement, Control & Testing industry event.

About IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Frequently Asked Questions about IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027

When is IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027?

IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 takes place from February 16, 2027 to February 18, 2027, running for 3 days at Tokyo International Exhibition Center (Tokyo Big Sight).

Where is IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 held?

IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 is held at Tokyo International Exhibition Center (Tokyo Big Sight), Japan. The venue address is 3-21-1 AriakeKoto-kuTokyo 135-0063. See full venue details →

Who exhibits at IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027?

Exhibitor information for IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 will be published closer to the event date.

Who organizes IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027?

Organizer information for IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027 will be published on the official fair page.

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